Very even consistent deposit, providing excellent etch resist performance. Tolerant to all commonly used dry films, eliminates gassing and associated defects. Based on methane sulphonic acid, the process gives a matt fine crystalline deposit with excellent covering power.
Unlike sulphuric acid based electrolytes, the solution will operate with titanium baskets, providing consistent anode area and 100% anode usage. The SAT 20-1 matt tin bath also has a high tolerance to all commonly used dry film resists.
Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based process gives a fine grain deposit, perfect as an etch resist, and with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.
Based on sulphuric acid, this long established plating solution used extensively in all sectors of the plating industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.
A high quality tin sulphate salt.
As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.
A purified methyl sulphonic acid concentrate.
Tin anodes may be supplied, as bars, slugs or dome shapes dependent upon customer requirements.
A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.