You are Here: Home > GMF Plating Processes > Tin Plating Processes

Tin Plating Processes

Bright Acid Tin Culmo NF

Based on sulphuric acid, this long established tin plating solution used extensively in all sectors of industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.

Equally suitable for rack and barrel applications, its superb solderability characteristics remain good even after long storage periods or heat ageing tests of 6 hours at 155°C.

Bright Acid Tin Acitin 2000 - 1

Based on sulphuric acid, Acitin 2000 - 1 is a further development of the well-established and successful Culmo tin plating process.

A main difference is the lower tin content, enabling more economical operation.

High Speed Pure Tin MBF 20

A high speed pure tin plating solution producing a silky-matt fine crystalline coating. This process is ideally suited to wire, reel to reel and spot plating applications.

High Speed Pure Tin MBF 20 - RB

A strongly acidic, fluoride-free tin plating process for the deposition of silky-matt fine crystalline coatings.

The deposits give excellent solderability even after heat ageing at 155°C for 16 hours. The process is suited for use in wire, reel-to-reel and spot plating applications and is very low foaming.

Pure Tin SLOTOTIN 40

Example of Slototin 40 pure tin deposit

A high speed tin plating electrolyte to produce a fine crystalline deposit of 3 - 8 μm. The deposit demonstrates a resistance to the formation of whiskers making it an ideal ‘lead-free’ finish for the electronics industry.

Matt Tin LC10

Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based tin plating process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.

Matt Tin SAT 20 - 1

A matt tin electrolyte based on methane sulphonic acid. The process gives a fine crystalline deposit with excellent covering power.

Unlike sulphuric acid based electrolytes, anode solubility in the easily maintained SAT 20 - 1 matt tin bath allows much higher anode current densities to be used.

High Speed Pure Tin GBF 30

This is a low foaming, fluoride-free acidic electrolyte for the deposition of bright tin coatings in reel-to-reel installations. Cathodic current densities up to 30 A/dm² can be achieved and the co-deposition of carbon is very low (only 0.02 %). Excellent solderability is exhibited, even after heat ageing. Since titanium is not attacked it is suitable to be used with titanium anode baskets.

Immersion Tin SN30 - 1

A replenishable immersion plating solution for the deposition of a protective coating of tin onto fabricated parts of copper and copper alloys.

The tin deposit provides good solderability retention after extended storage periods. It can also be used to clean and brighten oxidised lead or tin-lead electroplate.

Bright Tin SLOTOTIN 70 M

Suitable for both rack and barrel applications, this MSA based tin plating process is ideal for the plating of complex shaped items as the brightness of the deposit in low current densities is excellent.

Together with excellent tarnish resistance the deposit is solderable after heat ageing tests and, by using low foaming additives, solution foaming is not an issue.

Tin Ancillaries

Tin Coagulant FMN

A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.

Tin Salt SU

A high quality tin sulphate salt.

Tin Concentrates FS, FS20, FS100 & FS200

As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate.

Filter Aid FC

Is a cellulose based material, suitable for use in acidic electrolytes.

This filter aid can be used in either disc or cartridge style filters.

Anti Foam SN

Developed for use in tin or tin-lead baths where foaming results from strong turbulence.

Sulphuric Acid Pure 1.84

Pure sulphuric acid, suitable for the maintenance of tin, copper, nickel and a variety of processes.

Tin Anodes

Tin anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.

See Also.....

Follow us on:  

 

Schloetter Co Ltd

Abbey Works
New Road
Pershore
Worcs, UK
WR10 1BY

Tel:      +44(0)1386 552331

Web:     

E-mail:  info@schloetter.co.uk

Registered in England 947371

VAT No. GB 274 7177 31

accreditation logos