Platinum & Palladium Plating Processes
Palladium Plating Solutions
A weakly alkaline process for high speed, selective plating, in continuous lines producing a semi-bright to bright appearance.
Excellent bonding and solderability are seen together with low porosity and freedom from cracking.
Palladium 459 is a weakly alkaline electrolyte for the deposition of light, bright coatings up to a thickness of 0.5 µm.
This process is ideal for use as a palladium strike bath.
Palladium-Nickel 462 produces crack- free bright deposits containing 70 - 80% Palladium, dependant upon bath composition.
The corrosion resistant coatings have a hardness of 620 HV and can be deposited in either rack or barrel applications.
This process is an ammoniacal, high speed electrolyte for the deposition of Palladium-Nickel coatings containing 70 - 80% Palladium.
Ideally suited to reel-to-reel and jet plating techniques, Palladium-Nickel 466 produces ductile deposits of Palladium-Nickel with a hardness of 580 - 620 HV.
Platinum Plating Processes
The acid platinum bath PLATUNA N1 is used for the depositing smooth and brilliant coatings of a light colour up to a coating thickness of 1mm. The hardness of the coating is approximately 500 HV. The plating rate is 0.08 µm/min at 1.5 A/dm².
Other Precious metal plating solutions
- silver plating solutions
- Gold plating solutions
- Gold-alloy plating solutions
- Rhodium plating solutions