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Platinum & Palladium Plating Processes

Palladium Plating Solutions

PALLADIUM 451

A weakly alkaline process for high speed, selective plating, in continuous lines producing a semi-bright to bright appearance.

Excellent bonding and solderability are seen together with low porosity and freedom from cracking.

PALLADIUM 459

Palladium 459 is a weakly alkaline electrolyte for the deposition of light, bright coatings up to a thickness of 0.5 ┬Ám.

This process is ideal for use as a palladium strike bath.

Palladium-Nickel Processes

PALLADIUM-NICKEL 462

Palladium-Nickel 462 produces crack- free bright deposits containing 70 - 80% Palladium, dependant upon bath composition.

The corrosion resistant coatings have a hardness of 620 HV and can be deposited in either rack or barrel applications.

PALLADIUM-NICKEL 468

This process is an ammoniacal, high speed electrolyte for the deposition of Palladium-Nickel coatings containing 70 - 80% Palladium.

Ideally suited to reel-to-reel and jet plating techniques, Palladium-Nickel 466 produces ductile deposits of Palladium-Nickel with a hardness of 580 - 620 HV.

Platinum Plating Processes

PLATUNA N1

The acid platinum bath PLATUNA N1 is used for the depositing smooth and brilliant coatings of a light colour up to a coating thickness of 1mm.  The hardness of the coating is approximately 500 HV.  The plating rate is 0.08 µm/min at 1.5 A/dm².

Other Precious metal plating solutions

 

 

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