Nickel Plating Processes
Bright Nickel SLOTONIK 20
SLOTONIK 20 is a modern, bright-nickel plating bath, suitable for rack plating. The deposits are fully bright and highly ductile with excellent throwing power. Levelling is first class even with thin deposits and chromability is impressive. The separate brightener and leveller additives enable the user to generate reproducible finishes over a wide range of requirements
Bright Nickel SLOTONIK 30
The deposits from this high quality nickel electrolyte are fully bright and highly ductile with excellent throwing power and good levelling properties.
The solution is particularly suitable for barrel plating, operating over a wide range of current densities.
Superbright Nickel SLOTONIK 50
Superbright Nickel SLOTONIK 50 meets all the demands of a modern top quality nickel rack-plating electrolyte. The deposits are fully bright and highly ductile with excellent throwing power and excellent levelling even with thin deposits. The deposit is receptive to chrome plating.
The solution is easy to operate and can be air or mechanically agitated.
Semi-Bright Nickel SLOTONIK SB
Suitable for rack or barrel plating, this nickel plating process produces uniform semi-bright deposits over a current density range of 2 - 7 A/dm² (rack) and 0.4 - 2 A/dm² (barrel). It is operated at a pH of 3.8 - 4.5.
The solution is tolerant to impurities and produces extremely ductile deposits with excellent levelling properties.
Used generally in the electrical and electronics fields as an intermediate layer on various components this reliable nickel plating solution is operated mainly without additives.
The electrolyte produces light and relatively uniform nickel coatings on untarnished surfaces, the deposit being very ductile and extremely active, both important factors for subsequent electroplating.
Nickel Sulphamate MS
This nickel sulphamate electrolyte is particularly suitable for the deposition of highly ductile, thick nickel deposits with low internal tensile stress for use in the engineering, electronics and electroforming fields.
It can be operated over a wide range of conditions: at temperatures from 50 - 60°C at pH 4.0 and at current densities from below 7.5 A/dm² up to about 43 A/dm². Internal stress in the deposit is determined mainly by the chloride content and to a lesser extent by the pH.
The deposit characteristics are also influenced by the single BFL additive used.
Nickel Sulphamate 65% w/w
Purified nickel sulphamate solution.
Nickel Salts & Concentrates
High purity nickel sulphate, nickel chloride, nickel sulphamate and boric acid.
Nickel Additive G2
Inhibits the co-deposition of zinc in nickel baths. It also prevents passivation of nickel deposition and dark discoloration in low current density areas.
We supply Electrolytic and ‘S’ type nickel anode materials to suit your needs.
For further details see our anodes page.
Sulphuric Acid Pure 1.84
Pure sulphuric acid, suitable for the maintenance of copper, nickel and a variety of processes