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Electroless Nickel Plating Processes
Electroless Nickel SH840
An electroless nickel strike used prior to subsequent plating on delicate substrates. This will plate a uniform pore-free, adherent deposit on properly prepared substrates.
Additionally, its high tolerance for zinc makes it long lived and economical. This barrier layer will serve to extend the life of subsequent plating solutions by minimising zinc drag in.
Electroless Nickel SLOTONIP 1850
A Cadmium and Lead free, medium phosphorus electroless nickel plating solution, specifically formulated to provide an easy to operate, high-speed electroless nickel plating bath.
This process will produce a bright, uniform deposit with 6 - 9% phosphorus on ferrous, non-ferrous and non-conducting substrates such as ceramics and plastics.
SLOTONIP 1850 has an advanced stabiliser system, which allows excellent stability over the long life of the plating solution.
Electroless Nickel SLOTONIP 2010
A medium phosphorus electroless nickel plating process specifically formulated to provide an easy to operate, high speed plating bath.
This process will produce a fully bright, uniform deposit with 6 - 9% phosphorus on ferrous, non-ferrous and non-conducting substrates such as ceramics and plastics.
Electroless Nickel SLOTONIP 2110
A medium phosphorus electroless nickel plating process specifically formulated to provide an easy to operate, high speed plating bath.
This process will produce a semi-bright, uniform deposit with 6 - 9% phosphorus on ferrous, non-ferrous and non-conducting substrates such as ceramics and plastics.
Electroless Nickel SLOTONIP 70 A
A medium phosphorus (9 - 10 %) process producing semi-bright to bright deposits which are free of lead and cadmium.
The solution is easy to operate and maintain and has excellent stability. The pH is controlled with ammonia and the deposition rate for a new solution is approximately 18 - 22 µm/hour.
Electroless Nickel SLOTONIP 70 K
A medium phosphorus (9 - 10 %) process producing semi-bright to bright nickel deposits which are free of lead and cadmium
The solution is easy to operate and maintain and has excellent stability. It is free of ammonia and the deposition rate for a new solution is approximately 18 - 22 µm/hour.
Electroless Nickel SLOTONIP 90
A high phosphorus, heavy metal-free electroless nickel plating process giving deposits that are bright or semi-bright and contain 10.5 – 11.5% phosphorus.
The process is used where a high corrosion resistant finish is required.
Electroless Nickel SLOTONIP 90 is easy to operate, runs virtually problem free and is very stable.
Electroless Nickel Ancillaries
Activator PDI 10
An ionic palladium activator to initialise electroless deposition on non-conductors.
Alumenate Process
ALUMENATE utilises a new generation of processes for the pre-treatment and plating of aluminium and aluminium alloys. The sequence demonstrates many advantages and benefits over the traditional chemical formulations currently used.
The process steps are:-
- Non-etch cleaner
- Can safely use long immersion times
- Mild and controllable etching
- Choice of Alkaline or acid
- Etch rates from 0.05 µm/min
- Nitric-free desmut
- No NOx fumes
- Less aggressive on substrate
- Cyanide-free Zincate
- Safer
- Ultra thin zinc conversion coating