Tin Processes
Bright Acid Tin Culmo
Based on sulphuric acid, this long established plating solution used extensively in all sectors of industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.
Matt Tin LC10 (SAT10)
Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.
Matt Tin SAT 20
A matt tin electrolyte based on methane sulphonic acid. The process gives a fine crystalline deposit with excellent covering power.
Unlike sulphuric acid based electrolytes, anode solubility in the easily maintained SAT 20 matt tin bath allows much higher anode current densities to be used.
Immersion Tin SN30
A replenishable, immersion plating solution for the deposition of a protective coating of tin onto fabricated parts of copper and copper alloys.
The tin deposit provides good solderability retention after extended storage periods. It can also be used to clean and brighten oxidised lead or tin-lead electroplate.
Tin Ancillaries
Tin Coagulant FMN
A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.
Tin Salt SU
A high quality tin sulphate salt.
Tin Concentrates FS, FS20, FS100 & FS200
As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.
Acid Concentrate FF
A purified methyl sulphonic acid concentrate.
Anti Foam SN
Tin anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.