Based on sulphuric acid, this long established plating solution used extensively in all sectors of industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.

Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.

A matt tin electrolyte based on methane sulphonic acid. The process gives a fine crystalline deposit with excellent covering power.

A replenishable, immersion plating solution for the deposition of a protective coating of tin onto fabricated parts of copper and copper alloys.

A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.

A high quality tin sulphate salt.

As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.

A purified methyl sulphonic acid concentrate.

Developed for use in tin or tin-lead baths where foaming results from high turbulence.

Tin anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.