Tin Plating Processes used in the PCB Industry
Tin Plating Solutions
Bright Acid Tin CULMO NF
Based on sulphuric acid, this long established plating solution used extensively in all sectors of the plating industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.
Matt Tin LC10
Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.
Matt Tin SAT 20-1
A matt tin electrolyte based on methane sulphonic acid. The process gives a fine crystalline deposit with excellent covering power.
Unlike sulphuric acid based electrolytes, the solution will operate with titanium baskets, providing consistent anode area and 100% anode usage. The SAT 20-1 matt tin bath also has a high tolerance to all commonly used dry film resists.
Tin Coagulant FMN
A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.
Tin Salt SU
A high quality tin sulphate salt.
Tin Concentrates FS, FS20 & FS200
As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.
Acid Concentrate FF
A purified methyl sulphonic acid concentrate.
Anti Foam SN
Developed for use in tin or tin-lead plating baths where foaming results from high turbulence.
Tin anodes may be supplied, as bars, slugs or dome shapes dependent upon customer requirements.