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Tin Plating Processes used in the PCB Industry

Tin Plating Solutions

Bright Acid Tin CULMO NF

Based on sulphuric acid, this long established plating solution used extensively in all sectors of the plating industry, gives a bright pure tin deposit with excellent tarnish and corrosion resistance.

Matt Tin LC10

Ideally suited for the manufacture of PCBs, electronic and precision components, this sulphuric acid based process gives a fine grain deposit with excellent covering power and solderability. Deposits still give good solderability even after heat or steam ageing as required by MIL-M-38510G specification.

Matt Tin SAT 20-1

A matt tin electrolyte based on methane sulphonic acid. The process gives a fine crystalline deposit with excellent covering power.

Unlike sulphuric acid based electrolytes, the solution will operate with titanium baskets, providing consistent anode area and 100% anode usage. The SAT 20-1 matt tin bath also has a high tolerance to all commonly used dry film resists.

Tin Ancillaries

Tin Coagulant FMN

A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.

Tin Salt SU

A high quality tin sulphate salt.

Tin Concentrates FS, FS20 & FS200

As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate.

Anti Foam SN

Developed for use in tin or tin-lead plating baths where foaming results from high turbulence.

Tin Anodes

Tin anodes may be supplied, as bars, slugs or dome shapes dependent upon customer requirements.

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Schloetter Co Ltd

Abbey Works
New Road
Worcs, UK
WR10 1BY

Tel:      +44(0)1386 552331



Registered in England 947371

VAT No. GB 274 7177 31

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