Strippers & Etches used in the PCB industry
A stripper for aqueous dry-films especially designed for fine-line PCB manufacturing, eliminating the dry-film residues even in recessed areas or when over-lapping occurs.
Remover DFA95LC does not attack commonly used etch resists such as tin or tin-lead and does not give off unpleasant fumes.
It can be used both by spray and immersion, giving a very high yield.
The foam from the process is slight and easily controlled. In special circumstances , where film collection is poor, Antifoam DFA96 may be used.
This sulphuric acid based immersion-stripping solution is formulated for the stripping of nickel and tin from copper without attack on the base materials.
A new high yield, one-step immersion stripper for tin or tin-lead, based on stabilised nitric acid, avoiding harmful vapours due to nitrogen oxides. It can be replenished automatically using the "Density Controller".
The process has a high stripping rate with minimal etching of copper which is left bright.
A one-step spray stripper for tin or tin-lead based on stabilised nitric acid, giving a high stripping speed and high yield.
There is low attack of the copper surfaces, which are always perfectly bright, even after repeated passes through the stripping machine.
Two different versions of Stripper L30 can be made up.
The first version L30/1 is used for the immersion stripping of tin and tin-lead deposits from copper.
The second, L30/2 is used for the stripping of tin, tin-lead and copper deposits from stainless steel jigs and contacts.
An acidic, complexant-free process for the electrolytic stripping of tin, tin-lead, copper and nickel deposits from titanium jigs and contacts. It is especially suited for use in PCB and electronic applications and strips single or composite coatings equally well.