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Immersion Silver Processes
Slotochem AG10
An acidic process for the immersion deposition of silver on copper surfaces producing a solderable surface layers that is excellent even after 4 hours of heat ageing at 155°C.
For longer periods of storage boards should be post-dipped in Anti-tarnish AG110 to maintain the excellent solderability.
Slotochem AG 10 is a lead-free alternative to hot-air levelling and is compatible with silver bearing lead-free as well as conventional tin-lead based solders.
Pure Gold Processes
Auruna 510
An immersion gold bath for electroless deposition on electrodeposited or electrolessly deposited nickel layers, especially on printed circuit boards for Chip-On-Board technology (COB) or Surface-Mount Technology (SMT).
Very good solderability, bondability, long bath life and simple bath maintenance.
Free from EDTA.
Auruna 550
A neutral electrolyte with high current efficiency producing matt yellow, pure gold deposits. The deposit has excellent bonding and soldering properties making it ideal for printed circuit and semiconductor applications.
Auruna 557
This is a pure gold bath producing a deposit, which is extremely suitable for bonding applications. The deposit has good thermal stability (5 min at 500°C) and can be applied in either rack or barrel plating modes.
The process has a gold content of 8 g/l producing a deposition rate of 0.12 - 0.6 µm per minute and meets MIL-G 45204 classification III A.
Auruna 5000
A weakly acid, high purity gold deposit having excellent bonding properties.
Nickel- Gold Processes
Auruna 528
A weakly acid, hard gold plating electrolyte with high current efficiency. This nickel-alloyed gold plating solution is ideal for both printed circuit and decorative applications producing a yellow coloured deposit.
Brush Plating Gold Processes
Auruna 256
A process specifically for the brush plating repair of PCBs.
Thick, bright, hard and fine deposits are achieved.
Gold Strippers
Gold Stripper 645
A rapid, non-electrolytic stripper for removing gold and gold-alloy from a variety of substrates.
The solution does not generally attack the base material.
Temperature 25 - 35°C.
Stripping rate 0.5 - 1.0 µm per minute.
Capacity up to 20 g/l gold.
Gold Ancillaries
Auruna Fungicide 1
An effective non-foaming product for use in both gold plating baths and rinses.
Gold Potassium Cyanide
Gold Potassium Cyanide, 68% pure gold.
Supplied in 25 gram and 100 gram packs of gold metal.
Platinised Titanium Anodes
For use in gold and other noble metal solutions, platinised titanium anodes are available in 8 standard mesh sizes.
The anodes are made from 99.55% pure titanium, coated with 2.5 microns of platinum.
Both anodes and hooks are made to order to your required sizes.