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Slotochem AG10 An acidic process for the immersion deposition of silver on copper surfaces producing a solderable surface layers that is excellent even after 4 hours of heat ageing at 155°C. For longer periods of storage boards should be post-dipped in Antitarnish AG110 to maintain the excellent solderability. Slotochem AG 10 is a lead-free alternative to hot-air levelling and is compatible with silver bearing lead-free as well as conventional tin-lead based solders.
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Auruna 510 An immersion gold bath for electroless deposition on electrodeposited or electrolessly deposited nickel layers, especially on printed circuit boards for Chip-On-Board technology (COB) or Surface-Mount Technology (SMT). Very good solderability, bondability, long bath life and simple bath maintenance. Free from EDTA.
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Auruna 550 A neutral electrolyte with high current efficiency producing matt yellow, pure gold deposits. The deposit has excellent bonding and soldering properties making it ideal for printed circuit and semiconductor applications.
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Auruna 557 This is a pure gold bath producing a deposit, which is extremely suitable for bonding applications. The deposit has good thermal stability (5 min at 500°C) and can be applied in either rack or barrel plating modes. The process has a gold content of 8 g/l producing a deposition rate of 0.12 - 0.6 µm per minute and meets MIL-G 45204 classification III A.
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Auruna 5000 A weakly acid, high purity gold deposit having excellent bonding properties.
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Auruna 528 A weakly acid, hard gold plating electrolyte with high current efficiency. This nickel-alloyed gold plating solution is ideal for both printed circuit and decorative applications producing a yellow coloured deposit.
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Auruna 256 A process specifically for the brush plating repair of PCBs. Thick, bright, hard and fine deposits are achieved.
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Gold Stripper 645 A rapid, non-electrolytic stripper for removing gold and gold-alloy from a variety of substrates. The solution does not generally attack the base material. Temperature 25 - 35°C. Stripping rate 0.5 - 1.0 µm per minute. Capacity up to 20 g/l gold.
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Auruna Fungicide 1 An effective non-foaming product for use in both gold plating baths and rinses.
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Gold Potassium Cyanide Gold Potassium Cyanide, 68% pure gold. Supplied in 25 gram and 100 gram packs of gold metal.
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Platinised Titanium Anodes For use in gold and other noble metal solutions, platinised titanium anodes are available in 8 standard mesh sizes. The anodes are made from 99.55% pure titanium, coated with 2.5 microns of platinum. Both anodes and hooks are made to order to your required sizes.
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Page last updated: 18/03/08 |
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Schloetter
Company Ltd. Registered in England 947371 VAT No. GB 274 7177 31
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