Schloetter PCB Processes
  
Pre-treatment Processes

Slotoclean S20 PA

Based on phosphoric acid and supplied as a single concentrate, Slotoclean S20PA is ideal for the cleaning and activation of PCBs.

Because the product contains both surfactants and deoxidisers it is equally effective at removing both grease and copper oxide (with minimal copper attack of 0.5 to 1.0µ per hour).

Slotoclean S20PA is free of complexing agents, alkylphenolethoxylates and AOXs.

 


Slotoclean S20

Based on sulphuric acid, S20 is a highly efficient thiourea-free cleaner for the removal of grease, oil and oxides from copper surfaces.

 


Slotetch 584 Micro- Etch

A non-persulphate salt-based microetch for copper.

At low concentrations Slotetch 584 is ideal for finely etching the surface of thin copper deposits.

 


Incide H 99

A cleaner / microetch for copper surfaces.

Incide H-99 is a ready-to-use solution based on sulphuric acid and hydrogen peroxide. It is extremely reliable and also is able to remove fingerprints with a minimum attack of the copper surface. It ensures a uniform microetching and, when required, the etch rate can be increased by additions of Incide H-99 Additive.

It is suitable for many purposes including the preparation of innerlayers before dry-film lamination or the liquid photo-resist, and the preparation of copper surfaces before solder-mask or HASL.

Incide H-99 is complexing agents free for easy waste treatment.

 


MicroIncide PHP

A copper micro-etch based on sulphuric acid and hydrogen peroxide.

MicroIncide PHP assures a perfect and uniform micro-etch of the copper surfaces with a constant etch rate and a low consumption of hydrogen peroxide.

It contains no chelating agents, enabling easy and thorough removal of dissolved copper.

 


Antiox MLX

A new anti-oxidiser for copper.

It is easy to use and is economically advantageous due to its high concentration.

 


Cuprolite H86-1

A cleaner that can be used both as a conventional acid cleaner and as a cleaner-microetch, with a simple addition of hydrogen peroxide. It can be used both by spray and immersion and rapidly removes persistent fingerprints and oxides from the board’s surface. It does not contain copper complexing agents; it is easily rinsed and gives a very high yield.

 

Oxide Processes 

Sealbond Process

The Sealbond process combines the Bondenex process for black copper oxide with the new post dip Sealex 92 to give the effective elimination of "pink-ring".

This process increases the peel strength and shows better adhesion than standard adhesion promoter systems. It also gives an aesthetically uniform dark brown appearance.

Sealbond has a very wide operating window, is easy to control and gives a high yield.

Sealbond meets MIL-Spec. P55 110-D.


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Plating Technology

Schloetter Company Ltd.
Abbey Works
New Road
Pershore
Worcestershire WR10 1BY
UK

Registered in England 947371

VAT No. GB 274 7177 31

Tel: 01386 552331
Fax: 01386 561005
Email:  info@schloetter.co.uk

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