Based on phosphoric acid and supplied as a single concentrate, Slotoclean S20PA is ideal for the cleaning and activation of PCBs.

Because the product contains both surfactants and deoxidisers it is equally effective at removing both grease and copper oxide (with minimal copper attack of 0.5 to 1.0µ per hour).

Slotoclean S20PA is free of complexing agents, alkylphenolethoxylates and AOXs.

Based on sulphuric acid, S20 is a highly efficient thiourea-free cleaner for the removal of grease, oil and oxides from copper surfaces.

A non-persulphate salt-based microetch for copper.

At low concentrations Slotetch 584 is ideal for finely etching the surface of thin copper deposits.

A cleaner / microetch for copper surfaces.

Incide H-99 is a ready-to-use solution based on sulphuric acid and hydrogen peroxide. It is extremely reliable and also is able to remove fingerprints with a minimum attack of the copper surface. It ensures a uniform microetching and, when required, the etch rate can be increased by additions of Incide H-99 Additive.

It is suitable for many purposes including the preparation of innerlayers before dry-film lamination or the liquid photo-resist, and the preparation of copper surfaces before solder-mask or HASL.

A copper micro-etch based on sulphuric acid and hydrogen peroxide.

MicroIncide PHP assures a perfect and uniform micro-etch of the copper surfaces with a constant etch rate and a low consumption of hydrogen peroxide.

A new anti-oxidiser for copper.

A cleaner that can be used both as a conventional acid cleaner and as a cleaner-microetch, with a simple addition of hydrogen peroxide. It can be used both by spray and immersion and rapidly removes persistent fingerprints and oxides from the board’s surface. It does not contain copper complexing agents; it is easily rinsed and gives a very high yield.

The Sealbond process combines the Bondenex process for black copper oxide with the new post dip Sealex 92 to give the effective elimination of "pink-ring".

This process increases the peel strength and shows better adhesion than standard adhesion promoter systems. It also gives an aesthetically uniform dark brown appearance.

Sealbond has a very wide operating window, is easy to control and gives a high yield.

Sealbond meets MIL-Spec. P55 110-D.