Nickel Plating Processes used in the PCB Industry
Nickel Plating Solutions
Semi-Bright Nickel SLOTONIK SB
This nickel process produces uniform semi-bright nickel deposits over a current density range of 2 - 7 A/dm². It is operated at a pH of 3.8 - 4.5.
The solution, which is tolerant to impurities, produces extremely ductile deposits and is suitable for use under gold on edge connectors.
Nickel Sulphamate MS
This sulphamate electrolyte is particularly suitable for the deposition of highly ductile, thick nickel deposits with low internal tensile stress for use in the engineering, electronics and electroforming fields.
Nickel Salts & Concentrates
High purity Nickel Sulphate, Nickel Chloride, Nickel Sulphamate and Boric Acid.
We supply Electrolytic, 'D' crowns and ‘S’ type anode materials to suit your needs.
See our anodes page for more details.