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Lead Plating Solutions used in the PCB Industry

Lead Plating Processes

Matt Lead MSN 10-1

MSN 10-1 is a fluoride-free plating process for the deposition of matt fine-grained lead coatings.

In PCB applications, it can be used as an etch resist and in the company’s SLOTOTON process it is used at a thickness of 0.5 - 2 µm prior to tin-lead deposition providing improvements in solderability of PTH circuits.

Lead Ancillaries

Lead Concentrate FP

A liquid lead methane sulphonate concentrate containing 20% (w/w) lead.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate.

Lead Anodes

Lead anodes may be supplied as bars or slugs dependent upon customer requirements.

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Schloetter Co Ltd

Abbey Works
New Road
Worcs, UK
WR10 1BY

Tel:      +44(0)1386 552331



Registered in England 947371

VAT No. GB 274 7177 31

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