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Lead Plating Solutions used in the PCB Industry

Lead Plating Processes

Matt Lead MSN 10-1

MSN 10-1 is a fluoride-free plating process for the deposition of matt fine-grained lead coatings.

In PCB applications, it can be used as an etch resist and in the company’s SLOTOTON process it is used at a thickness of 0.5 - 2 µm prior to tin-lead deposition providing improvements in solderability of PTH circuits.

Lead Ancillaries

Lead Concentrate FP

A liquid lead methane sulphonate concentrate containing 20% (w/w) lead.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate.

Lead Anodes

Lead anodes may be supplied as bars or slugs dependent upon customer requirements.

Schloetter Co Ltd

Abbey Works

New Road

Pershore

Worcs, UK

WR10 1BY

Tel:      +44(0)1386 552331

E-mail: info@schloetter.co.uk

Registered in England 947371

VAT No. GB 274 7177 31

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