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Lead Plating Solutions used in the PCB Industry
Lead Plating Processes
Matt Lead MSN 10-1
MSN 10-1 is a fluoride-free plating process for the deposition of matt fine-grained lead coatings.
In PCB applications, it can be used as an etch resist and in the company’s SLOTOTON process it is used at a thickness of 0.5 - 2 µm prior to tin-lead deposition providing improvements in solderability of PTH circuits.
Lead Ancillaries
Lead Concentrate FP
A liquid lead methane sulphonate concentrate containing 20% (w/w) lead.
Acid Concentrate FF
A purified methyl sulphonic acid concentrate.
Lead Anodes
Lead anodes may be supplied as bars or slugs dependent upon customer requirements.