A cleaner / microetch for copper surfaces.

Incide H-99 is a ready-to-use solution based on sulphuric acid and hydrogen peroxide. It is extremely reliable and also is able to remove fingerprints with a minimum attack of the copper surface. It ensures a uniform microetching, and when required, the etch rate can be increased by additions of Incide H-99 Additive.

It is suitable for many purposes including the preparation of innerlayers before dry-film lamination or the liquid photo-resist, and the preparation of copper surfaces before solder-mask or HASL.

This is a new water soluble, highly thermal stable flux with low viscosity. It is completely water washable after the HASL process and does not leave any residue on the surface of the PCB.

The process is free from chlorides and gives only a small drag-in of copper in the tin-lead solder pot.

It is supplied ready-to-use, has low viscosity thus reducing consumption and is replenishable.

This versatile electroless copper process can work as a high, medium or low build bath.

Cuprothick '84 gives a clear deposit, easing hole inspection, is very stable and does not require continuous filtration.

Concentrated liquid replenishers reduce the bail out.

It has a wide operating window even with extremely varied working conditions, ensuring the complete coverage both on epoxy resin and on glass fibres.