Gold Plating Processes used in the PCB Industry
Pure Gold Processes
A neutral electrolyte with high current efficiency, producing matt yellow, pure gold deposits. The deposit has excellent bonding and soldering properties making it ideal for printed circuit and semiconductor applications.
A weakly acid, hard gold plating electrolyte with high current efficiency. This nickel-alloyed gold plating solution is ideal for both printed circuit and decorative applications producing a yellow coloured deposit.
A weakly acidic, cobalt alloyed, hard gold electrolyte, ideal for printed circuit boards with sensitive resists. The high efficiency (65%) and moderate pH of this process, limit the amount of gassing that might damage resist films.
Gold Stripper 645
A rapid, non-electrolytic stripper for removing gold and gold-alloy from a variety of substrates.
The solution does not generally attack the base material.
Temperature 25 - 35°C.
Stripping rate 0.5 - 1.0 µm per minute.
Capacity up to 20 g/l gold.
AURUNA fungicide 2
An effective non-foaming product for use in both gold plating baths and rinses.
Gold Potassium Cyanide
Gold Potassium Cyanide, 68% pure gold.
Supplied in 25 gram and 100 gram packs of gold metal.
Platinised Titanium Anodes
For use in gold and other noble metal solutions, platinised titanium anodes are available in 8 standard mesh sizes.
The anodes are made from 99.55% pure titanium, coated with 2.5 microns of platinum.
Both anodes and hooks are made to order to your required sizes.