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PCB Final Finishes
Immersion Tin SN 30-1
A replensihable immersion tin plating solution for the deposition of a solderable coating of tin onto copper.
The tin deposit provides good solderability retention, even after extended storage periods. It can also be used to clean and brighten oxidised lead or tin-lead electroplate.
ORGASOL SMT
ORGASOL SMT reacts selectively with copper surfaces forming a thin, organic film, which prevents oxidation and assures solderability for many months.
It is highly resistant to thermal treatment, producing perfectly solderable copper surfaces, even after many infra-red treatments.
Circuits protected with ORGASOL SMT are characterised by perfectly flat copper surfaces, excellent for automatic assembly of fine pitch components.
The process is comp[atible with common wave soldering fluxes and does not contain organic solvents or copper chelator.