A key factor in the success of Slotocoup PC81 acid copper has been its suitability for the deposition of thick and very ductile deposits.

Other advantages include its ability to withstand the most demanding thermal cycle tests and to operate over a wide range of current densities.

This acid copper process is specifically developed for electroplating onto low conductivity surfaces in direct metallisation systems.

It uses a single additive specially formulated for the plating of DMS coated holes in which the initiation of the ductile copper layer is of prime importance to the hole profile.

Compared with other standard coppers, it gives much faster coverage of low conductivity surfaces and improves metal distribution in the hole.

Slotocoup CU120 is also suitable for conventional electroless copper coated boards giving bright, fine grained and very ductile deposits.

Especially developed for the DC electroplating of blind micro-vias, Slotocoup CU140 is an ideal process for through hole plating.

It deposits bright copper coatings with low internal stress, excellent ductility and metal distribution.

Developed for the filling of blind vias in either pattern or panel plating mode, the Slotocoup BV110 process has exceptional levelling capability.

The brilliant deposit displays good ductility with low internal stress.

Slotocoup CU110 is designed to optimise the benefits obtainable from periodic reverse pulse plating in the volume production of complex plated through-hole PCBs.

Maintained with a single multi-component additive and operating in conjunction with pulse plating, the process can significantly reduce plating times.

Excellent surface metal distribution ratios and fine grain, very ductile deposits are provided. It can also be used for conventional DC plating.

This purified liquid concentrate provides trouble free manufacture and maintenance of all copper sulphate plating solutions.