Copper Plating Processes
Acid Copper Slotocoup PC81
A key factor in the success of Slotocoup PC81 acid copper plating solution has been its suitability for the deposition of thick and very ductile deposits.
Other advantages include its ability to withstand the most demanding thermal cycle tests and to operate over a wide range of current densities.
Using a single additive system, which produces no detrimental breakdown products, the bath remains stable after being left for long periods.
With excellent throwing power and distribution, the PC81 process gives reliable hole to surface ratios of 1:1 ideally suited for plating PCBs. Deposition rate is approximately 0.89 µm/minute at 4 amps/dm2.
Copper Processes for DMS
Acid Copper Slotocoup CU120
This acid copper plating solution is specifically developed for electroplating onto low conductivity surfaces in direct metallisation systems.
It uses a single additive specially formulated for the plating of DMS coated holes in which the initiation of the ductile copper layer is of prime importance to the hole profile.
Compared with other standard copper processes, it gives much faster coverage of low conductivity surfaces and improves metal distribution in the hole.
The Slotocoup CU120 process is also suitable for conventional electroless copper coated boards giving bright, fine grained and very ductile deposits.
Acid Copper Slotocoup CU140
Especially developed for the DC electroplating of blind micro-vias, Slotocoup CU140 is an ideal process for through hole plating.
It deposits bright copper coatings with low internal stress, excellent ductility and metal distribution.
Copper Processes for Blind Via Filling
Acid Copper Slotocoup BV110
Developed for the filling of blind vias in either pattern or panel plating mode, the Slotocoup BV110 process has exceptional levelling capability.
The brilliant deposit displays good ductility with low internal stress.
Copper Processes for Pulse Plating
Acid Copper Slotocoup CU110
Slotocoup CU110 is designed to optimise the benefits obtainable from periodic reverse pulse plating in the volume production of complex plated through-hole PCBs.
Maintained with a single multi-component additive and operating in conjunction with pulse plating, the process can significantly reduce plating times.
Excellent surface metal distribution ratios and fine grain, very ductile deposits are provided. It can also be used for conventional DC plating.
Copper Processes Ancillaries
Copper Sulphate 300 g/l
This purified liquid concentrate provides trouble free manufacture and maintenance of all copper sulphate plating solutions.
Copper Anodes Phosphorous De-oxidised
Developed for use with copper sulphate plating solutions.