Schloetter Plating Processes
  
Nickel Processes 

Bright Nickel Slotonik 10

Used for rack or barrel plating, this bright nickel process produces mirror bright and haze-free white coloured deposits.

These properties coupled with high ductility and tolerance to impurities makes the process particularly suitable for decorative applications, in particular as an undercoat for silver.


Bright Nickel Slotonik 20


Slotonik 20 is a modern, bright-nickel plating bath, suitable for rack plating.

The deposits are fully bright and highly ductile with excellent throwing power.

Levelling is first class even with thin deposits and chromability is impressive. The separate brightener and leveller additives enable the user to generate reproducible finishes over a wide range of requirements


Bright Nickel Slotonik 30

The deposits from this high quality nickel electrolyte are fully bright and highly ductile with excellent throwing power and good levelling properties.

The solution is particularly suitable for barrel plating, operating over a wide current density range.

 


Semi-Bright Nickel Slotonik SB

Suitable for rack or barrel plating, this nickel process produces uniform semi-bright deposits over a current density range of 2 - 7 A/dm² (rack) and 0.4 - 2 A/dm² (barrel). It is operated at a pH of 3.8 - 4.5.

The solution is tolerant to impurities and produces extremely ductile deposits with excellent levelling properties.

 


Nickel Additive ICA

When this additive is added to a nickel bath contaminated with iron, the iron is co-deposited with the nickel.

As the iron is reduced to its divalent form simultaneously, the electrolyte is self-cleaning during operation. The co-deposited iron, usually less than 1%, has no detrimental effect on the visual or corrosion properties of the deposit.

 


Nickel Additive G2

Inhibits the co-deposition of zinc in nickel baths. It also prevents passivation of nickel deposition and dark discoloration in low current density areas.

 


Nickel Norma

Used generally in the electrical and electronics fields as an intermediate layer on various components this reliable nickel is operated mainly without additives.

The electrolyte produces light and relatively uniform nickel coatings on untarnished surfaces, the deposit being very ductile and extremely active, both important factors for subsequent electroplating.

 


Nickel Sulphamate MS

This sulphamate electrolyte is particularly suitable for the deposition of highly ductile thick nickel deposits with low internal tensile stress for use in the engineering, electronics and electroforming fields.

It can be operated over a wide range of conditions: at temperatures from 50 - 60°C at pH 4.0 and at current densities from below 7.5 A/dm² up to about 43 A/dm². Internal stress in the deposit is determined mainly by the chloride content and to a lesser extent by the pH.

The deposit characteristics are also influenced by the single BFL additive used.

 

  
Nickel Ancillaries 

Nickel Sulphamate 65% w/w

Purified Nickel Sulphamate solution.

 


Nickel Salts & Concentrates

High purity Nickel Sulphate, Nickel Chloride, Nickel Sulphamate and Boric Acid.

 


Nickel Anodes

We supply Electrolytic and ‘S’ type anode materials to suit your needs.

 Nickel Anodes


Sulphuric Acid Pure 1.84

Pure sulphuric acid, suitable for the maintenance of copper, nickel and a variety of processes

 


Page last updated: 18/03/08

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Plating Technology

Schloetter Company Ltd.
Abbey Works
New Road
Pershore
Worcestershire WR10 1BY
UK

Registered in England 947371

VAT No. GB 274 7177 31

Tel: 01386 552331
Fax: 01386 561005
Email:  info@schloetter.co.uk

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